Abstract
In this article was an OFHC copper tested by static and dynamic tensile tests at the room temperature. Static and dynamic tensile tests allow wide range of strain rate achievement and its influence on mechanical properties investigation. Because of microstructure and strain rate observation the CG (coarse-grained) and UFG (ultrafine-grained) copper was used for tensile testing purpose. Based on results was found that ultimate tensile strength (Rm) increases and reduction of area (Z) decreases with increasing strain rate. However, the microstructure influence was revealed in reduction of area progress. During static conditions was found her inverse progress resulting from different structure (CG, UFG). The experiment was also focused on investigation of load development during ECAP processing.